Alphane Moon@lemmy.ml to Hardware@lemmy.mlEnglish · 3 months agoTSMC's 3D Stacked SoIC Packaging Making Quick Progress, Eyeing Ultra-Dense 3μm Pitch In 2027www.anandtech.comexternal-linkmessage-square0fedilinkarrow-up113arrow-down11cross-posted to: [email protected]
arrow-up112arrow-down1external-linkTSMC's 3D Stacked SoIC Packaging Making Quick Progress, Eyeing Ultra-Dense 3μm Pitch In 2027www.anandtech.comAlphane Moon@lemmy.ml to Hardware@lemmy.mlEnglish · 3 months agomessage-square0fedilinkcross-posted to: [email protected]